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product structure silicon monolithic integrated circuit this product is not designed protection against radioactive ray s 1/ 15 tsz02201-0f1f0ag00060-1-2 ? 2014 rohm co., ltd. all rights reserved. 8.dec.2014 rev.002 www.rohm.com tsz22111 ? 14 ? 001 single-chip type with built-in fet switching regulator series 1.0a, step-down switching regulators with built-in power mosfet bu 90054gwz general description the bu 90054 gwz are a high efficiency 6mhz synchronous step-down switching regulator with ultra low current pfm mode. it provides up to 1.0a load current and an input voltage range from 3.0v to 5.5v, optimized for battery powered portable applications. bu 90054 gwz has a mode control pin that allows the user to select forced pwm(pulse width modulation) mode or pfm(pulse frequency modulation) and pwm auto change mode utilized power save operation at light load current. features ? fast transient response ? automatic pfm/pwm operation ? forced pwm operation ? internal soft start ? under voltage lockout ? over current protection ? thermal shutdown lineup pin configuration(s) applications smart phones, cell phones, portable applications and micro dc/dc modules, usb accessories package(s) w(typ.) x d(typ.) x h(max.) ucsp30 l1 1.30mm x 0.90mm x 0.33 mm typical application circuit(s) pin description(s) part no. output voltage input voltage switching frequency operating mode mode=l mode=h bu90054gwz 1.80v 2.3v to 5.5v 4.8mhz to 6.0mhz automatic pfm/pwm forced pwm pin no. symbol function a1 vin power supply input pin a2 en enable pin a3 gnd gnd pin b1 mode forced pwm mode pin b2 lx inductor connection pin b3 fb feedback voltage input pin figure 1. typical application circuit(s) gnd lx vin en fb 1.0uh 4.7uf vout mode 2.3 5.5v 4.7uf (bottom view) figure 2. pin configuration(s) b1 mode b2lx b3 fb a1 vin a2 en a3 gnd datashee t downloaded from: http:///
2/15 bu90054gwz tsz02201-0f1f0ag00060-1-2 ? 2014 rohm co., ltd. all rights reserved. 8.dec.2014 rev.002 www.rohm.com tsz22111 ? 15 ? 001 block diagram(s) de scription of block(s) the bu 90054 gwz are a synchronous step-down dc/dc converter that achieves fast tr ansient response from light load to heavy load by hysteretic pwm control system and current constant pfm control system. pwm control bu 90054 gwz operates by hysteretic pwm control. this scheme ens ures fast switching, high efficiency, and fast transient response. when the output voltage is below the vref voltage, the error comparator o utput is low to high and turning on p-channel mosfet until above the vref voltage and minimum on time. pfm control at light load the regulator and mode=low, the regulator operates with re duced switching frequency and improves the efficiency. during pfm operation, the output voltage slightly higher t han typical output voltage. figure 4. op eration of pfm mode and pwm mode figure 3. block diagram(s) gnd lx vin en + - shutdown tsd error comp fb frequency control uvlo vref switching control logic and gate driver mode pwm/pfm control b1 1.5 0.47uh 4.7uf vout 2.3 5.5v vout h on l off l pwm/pfm mode h pwm mode a1 b2 a3 a2 b3 en output pwm mode voltage pfm mode at light load pfm threshold. turn on pch fet pwm mode at moderate to heavy loads pfm (constant current) threshold. turn off pch fet downloaded from: http:///
3/15 bu90054gwz tsz02201-0f1f0ag00060-1-2 ? 2014 rohm co., ltd. all rights reserved. 8.dec.2014 rev.002 www.rohm.com tsz22111 ? 15 ? 001 description of operations 1) shutdown if the en input pin set to low (<0.4v), all circuit are shut down and th e regulator is standby mode. do not leave the en pin floating. 2) soft start function the regulator has a soft start circuit that reduces in-rush current at start- up. typical start up times with a 4.7uf output capacitor is 120usec. 3) current limit the bu 90054 gwz has a current limit circuit that protects itself and externa l components during overload condition. 4) uvlo the bu 90054 gwz has an under voltage lock out circuit that turn off device when vin>2.05v(typ.) 5) forced pwm mode setting mode pin high (>1.4v) places the regulator in forced pwm.this c ontrol provides noise reduction and output stability. do not leave the mode pin floating. 6) tsd the bu 90054 gwz has a thermal shutdown feature to protect the device if the ju nction temperature exceeds 150 . in thermal shutdown, the driver is disabled. this circuit is only to cut off the ic from thermal runaway, and has no t been design to protect or guarantee the ic. therefore, the user should not plan to activate this circuit with continued operation in mind. absolute maximum ratings (ta=25 ) (*1) when mounted on the specified pcb (55mm x 63mm), deducted by 3.9m w/c when used over ta=25c recommended operating rating(s) parameter symbol rating unit maximum input power supply voltage vin 7 v maximum voltage at en, fb, lx, mode ven, vfb, vlx, vmode 7 v power dissipation pd 0.39 *1 w operating temperature range topr - 40 to +85 storage temperature range tstg - 55 to +125 junction temperature tjmax +125 parameter symbol rating unit min. typ. max. input voltage vin 2.3 - 5.5 v downloaded from: http:///
4/15 bu90054gwz tsz02201-0f1f0ag00060-1-2 ? 2014 rohm co., ltd. all rights reserved. 8.dec.2014 rev.002 www.rohm.com tsz22111 ? 15 ? 001 electrical characteristic(s) (unless otherwise specified vin= 3. 6v, ta=25 ) item symbol rating unit condition min. typ. max. switching regulator output voltage accuracy vouta 1.764 1.800 1.836 v mode:h(pwm operation) 1.764 1.800 1.854 mode:l(pfm operation) maximum load current ioutmax1 - - 1.0 a 3.0v Q vin 5.5v ioutmax2 - - 0.8 a 2.7v Q vin 3.0v ioutmax3 - - 0.6 a 2.3v Q vin 2.7v soft start soft start time tss 65 120 240 usec frequency control switching frequency fosc 4.8 5.4 6.0 mhz no load, mode:h driver pchfet on resistance ronp1 - 250 400 mohm vin=5.0v ronp2 300 450 mohm vin=3.6v nchfet on resistance ronn1 - 220 350 mohm vin=5.0v ronn2 250 380 mohm vin=3.6v control en pin control voltage operation venh 1.4 - vin v non operation venl 0 - 0.4 v mode pin control voltage operation vmodeh 1.4 - vin v forced pwm non operation vmodel 0 - 0.4 v automatic pfm/pwm uvlo protect threshold voltage uvth 1.95 2.05 2.15 v hysteresis uvhy 50 100 150 mv current limit current limit threshold ilimit 1.5 1.7 1.9 a pmos current detect, open loop output discharge output discharge resistance dres 55 110 220 ohm en=0v circuit current operating quiescent current iins1 - 45 65 ua en:h, mode:l, vout=3.6v forced not switching shutdown current shd - 0 1 ua en=0v downloaded from: http:///
5/15 bu90054gwz tsz02201-0f1f0ag00060-1-2 ? 2014 rohm co., ltd. all rights reserved. 8.dec.2014 rev.002 www.rohm.com tsz22111 ? 15 ? 001 electrical characteristic curves (reference data) parts l:lqm21mpn1r0ng0 (2.0mm1.6mm1.0mm murata) cout:grm155r60j475m(1.0mm0.5mm0.5mm murata) figure 5 . start up figure 6 . shut down figure 7 . load transient response 5ma to 200ma tr=tf=100ns, mode : low figure 8 . load transient response 50ma to 350ma tr=tf=100ns, mode :low vout 50mv/div ac coupled iout 200ma/div en 5v/div vout 1v/div vout 50mv/div ac coupled iout 200ma/div en 5v/div vout 1v/div il 200ma/div 40us 100us 4us 4us downloaded from: http:///
6/15 bu90054gwz tsz02201-0f1f0ag00060-1-2 ? 2014 rohm co., ltd. all rights reserved. 8.dec.2014 rev.002 www.rohm.com tsz22111 ? 15 ? 001 figure 9 . load transient response 200ma to 600ma tr=tf=100ns, mode : low figure 10 . pfm mode operation, iout=50ma figure 11. pwm mode operation, iout=100ma figure 12 . mode change response mode : high to low mode 5v/div vout 50mv/div ac coupled lx 200ma/div vout 20mv/div ac coupled lx 2v/div vout 50mv/div ac coupled iout 200ma/div vout 20mv/div ac coupled lx 2v/div 4us 80ns 400ns 4us downloaded from: http:///
7/15 bu90054gwz tsz02201-0f1f0ag00060-1-2 ? 2014 rohm co., ltd. all rights reserved. 8.dec.2014 rev.002 www.rohm.com tsz22111 ? 15 ? 001 0 10 20 30 40 50 60 70 80 90 100 0.1 1 10 100 1000 efficiency[%] load current[ma] 1.764 1.782 1.800 1.818 1.836 1.854 0 200 400 600 800 1000 output voltage[v] load current[ma] figure 13 . mode change response mode : low to high figure 15 . load regulation pwm/pfm auto mode figure 14. efficiency vs load current pwm/pfm auto mode mode 5v/div vout 50mv/div ac coupled lx 200ma/div 2us vin=2.7v vin=3.6v vin=4.2v vin=2.7v vin=3.6v vin=4.2v 60 65 70 75 80 85 90 95 100 2.5 3 3.5 4 4.5 5 5.5 efficiency [%] vin [v] figure 16. efficiency vs vin pwm/pfm auto mode , iout=1 25 ma l : dfe2520 12 c1r0 downloaded from: http:///
8/15 bu90054gwz tsz02201-0f1f0ag00060-1-2 ? 2014 rohm co., ltd. all rights reserved. 8.dec.2014 rev.002 www.rohm.com tsz22111 ? 15 ? 001 0 1 2 3 4 5 6 7 8 0 200 400 600 800 1000 frequency [mhz] load current [ma] 0 1 2 3 4 5 6 7 8 0 200 400 600 800 1000 frequency [mhz] load current [ma] figure 17. frequency vs load current pwm/pfm auto mode figure 18 . frequency vs load current pwm mode operation downloaded from: http:///
9/15 bu90054gwz tsz02201-0f1f0ag00060-1-2 ? 2014 rohm co., ltd. all rights reserved. 8.dec.2014 rev.002 www.rohm.com tsz22111 ? 15 ? 001 pc board layout the suggested pcb layout for the bu 90054gwz are shown in figure. the following guidelines s hould be used to ensure a proper layout. 1) the input capacitor cin should be connect as closely possible to vin pin and gnd pin. 2) from the output voltage to the fb pin line should be as separate a s possible. 3) cout and l should be connected as closely as possible. the conn ection of l to the lx pin should be as short as possible. figure 19. pcb layout external parts selection inductor selection the inductance significantly depends on output ripple current. as shown by following equation, the ripple current decreases as the inductor and/or switching frequency increase. f: switching frequency l: inductance S i l : inductor current ripple as a minimum requirement, the dc current rating of the inductor shoul d be equal to the maximum load current plus half of the inductor current ripple as shown by the following equation. cin l cout lx vin gnd en vout mode fb (vin-vout) vout S i l = l vin f S i l i lpeak = 2 i outmax + downloaded from: http:///
10 /15 bu90054gwz tsz02201-0f1f0ag00060-1-2 ? 2014 rohm co., ltd. all rights reserved. 8.dec.2014 rev.002 www.rohm.com tsz22111 ? 15 ? 001 1) recommended inductor selection ? iout Q 1a lqm2mpn1r0ng0 (2.0mm 1.6mm 1.0mm murata) mipsz2016d1r0fh (2.0mm 1.6mm 1.0mm fdk) dfe252012c1r0 (2.5mm 2.0mm 1.2mm toko) dfe252010c1r0 (2.5mm 2.0mm 1.0mm toko) ? iout Q 0.6a lqm21pn1r0ngc (2.0mm1.2mm1.0mm murata) mipsz2012d1r0 (2.0mm 1.2mm 1.0mm fdk) mipstz1608d1r0 (1.6mm 0.8mm 0.8mm fdk) mlp2012h1r0m (2.0mm1.2mm1.0mm tdk) ckp2012n1r0n (2.0mm1.2mm1.0mm taiyo yuden) 2) recommended input capacitor(cin) selection grm155r60j225m (1.0mm 0.5mm 0.5mm murata) grm155r60j475m (1.0mm 0. 5mm 0.5mm murata) grm155r60g106m (1.0mm 0.5mm 0.5mm murata) 3) recommended output capacitor(cout) selection grm155r60j475m (1.0mm 0.5mm 0.5mm murata) grm155r60g106m (1.0mm 0.5mm 0.5mm murata) downloaded from: http:///
11 /15 bu90054gwz tsz02201-0f1f0ag00060-1-2 ? 2014 rohm co., ltd. all rights reserved. 8.dec.2014 rev.002 www.rohm.com tsz22111 ? 15 ? 001 i/o equivalence circuit(s) a2 en b1 mode b2 lx b3 fb vin vin vin vin downloaded from: http:///
12 /15 bu90054gwz tsz02201-0f1f0ag00060-1-2 ? 2014 rohm co., ltd. all rights reserved. 8.dec.2014 rev.002 www.rohm.com tsz22111 ? 15 ? 001 caution of use 1) absolute maximum ratings an excess in the absolute maximum rating, such as supply voltage, temperature range of operating conditions, etc., can break down the devices, thus making impossible to iden tify breaking mode, such as a short circuit or an open c ircuit. if any over rated values will expect to exceed the absolute maximum ratings, consider adding circuit protection devi ces, such as fuses. 2) gnd voltage the potential of gnd pin must be minimum potential in all condi tion. as an exception, the circuit design allows voltages up to -0.3 v to be applied to the ic pin. 3) thermal design use a thermal design that allows for a sufficient margin in light of the power dissipation (pd) in actual operating conditions. 4) inter-pin shorts and mounting errors use caution when positioning the ic for mounting on printe d circuit boards. the ic may be damaged if there is any connection error or if pins are shorted together. 5) actions in strong electromagnetic fie ld use caution when using the ic in the presence of a strong el ectromagnetic field as doing so may cause the ic to malfunction. 6) mutual impedance power supply and ground wiring should reflect considerati on of the need to lower mutual impedance and minimize r ipple as much as possible (by making wiring as short and thic k as possible or rejecting ripple by incorporating induc tance and capacitance). 7) thermal shutdown circuit (tsd circuit) this model ic has a built-in tsd circuit. this circuit is only to cut off the ic from thermal runaway, and has not been design to protect or guarantee the ic. therefore, the user should not plan to activate this circuit with continued operation in mind. 8) regarding input pin of the ic this monolithic ic contains p+ isolation and p substrate lay ers between adjacent elements in order to keep them isolated. p-n junctions are formed at the intersection of these p la yers with the n layers of other elements, creating a parasi tic diode or transistor. for example, as shown in the figures below, the relation between each potential is as follows: when gnd > pin a and gnd > pin b, the p-n junction operates as a parasi tic diode. when gnd > pin b, the p-n junction operates as a parasitic transistor. parasitic diodes can occur inevitable in the structure of th e ic. the operation of parasitic diodes can result in mutua l interference among circuits, operational faults, or phys ical damage. accordingly, methods by which parasitic di odes operate, such as applying a voltage that is lower than the gnd (p su bstrate) voltage to an input pin, should not be used. 9) disturbance light in a device where a portion of silicon is exposed to li ght such as in a wl -csp, ic characteristics may be affected due to photoelectric effect. for this reason, it is recommended to co me up with countermeasures that will prevent the chip from being exposed to light. status of this document the japanese version of this document is formal specific ation. a customer may use this translation version only for a reference to help reading the formal version. if there are any differences in translation version of this docu ment formal version takes priority downloaded from: http:///
13 /15 bu90054gwz tsz02201-0f1f0ag00060-1-2 ? 2014 rohm co., ltd. all rights reserved. 8.dec.2014 rev.002 www.rohm.com tsz22111 ? 15 ? 001 ordering information b u 9 0 0 5 4 g w z e 2 part number packa ge gwz: ucsp30 l1 packaging and forming specification e2: embossed tape and reel (ucsp30 l1) marking diagram(s)(top view) ucsp30l1 ( top view ) adh 1 pin mark lot number part number marking downloaded from: http:///
14 /15 bu90054gwz tsz02201-0f1f0ag00060-1-2 ? 2014 rohm co., ltd. all rights reserved. 8.dec.2014 rev.002 www.rohm.com tsz22111 ? 15 ? 001 physical dimension tape and reel information package name ucsp30l1 ( bu90054gwz ) < tape and reel information > tape embossed carrier tape quantity 6000 p cs direction of feed e2 the direction is the pin 1 of product is at the upper le ft when you hold reel on the left hand and you pull out the tape on the right hand reel direction of feed 1pin 1234 1234 1234 1234 1234 1234 2 0. 25 0. 05 0.90 0.05 a a 3 1pin mark b 0.33max 0.25 0.05 s 0. 06 1. 30 0. 05 1 6- 0. 20 0. 05 b 0.4 0.06 b p=0.4 2 a 0. 05 s adh lot no. unit mm downloaded from: http:///
15 /15 bu90054gwz tsz02201-0f1f0ag00060-1-2 ? 2014 rohm co., ltd. all rights reserved. 8.dec.2014 rev.002 www.rohm.com tsz22111 ? 15 ? 001 revision history date revision changes 29 .jul. 20 14 001 new release. 8.dec.2014 002 page10 recommended inductor selection dfe252010c1r0 added. page12 caution of use 9) disturbance light added. downloaded from: http:///
notice- ge rev.003 ? 2013 rohm co., ltd. all rights reserved. notice precaution on using rohm products 1. our products are designed and manufactured for application in ordinary electronic equipments (such as av equipment, oa equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). if you intend to use our products in devices requiring extremely h igh reliability (such as medical equipment (note 1) , transport equipment, traffic equipment, aircraft/spacecraft, nuclear powe r controllers, fuel controllers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property ( specific applications ), please consult with the rohm sales representative in adv ance. unless otherwise agreed in writing by rohm in advance, rohm s hall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arisin g from the use of any rohm s products for specific applications. (note1) medical equipment classification of the specific app lications japan usa eu china class class class b class class | class 2. rohm designs and manufactures its products subject to s trict quality control system. however, semiconductor products can fail or malfunction at a certain rate. please be sure to implement, at your own responsibilities, adeq uate safety measures including but not limited to fail-safe desig n against the physical injury, damage to any property, whic h a failure or malfunction of our products may cause. the followi ng are examples of safety measures: [a] installation of protection circuits or other protective devic es to improve system safety [b] installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. our products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditions, as exemplified be low. accordingly, rohm shall not be in any way responsible or liable for any damages, expenses or losses arisi ng from the use of any rohms products under any special or extraordinary environments or conditions. if you intend to use our products under any special or extraordinary environments or conditions (as exemplified belo w), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be n ecessary: [a] use of our products in any types of liquid, including water, oils, chemicals, and organi c solvents [b] use of our products outdoors or in places where the products are exposed to direct sunlight or dust [c] use of our products in places where the products are e xposed to sea wind or corrosive gases, including cl 2 , h 2 s, nh 3 , so 2 , and no 2 [d] use of our products in places where the products are exposed t o static electricity or electromagnetic waves [e] use of our products in proximity to heat-producing component s, plastic cords, or other flammable items [f] sealing or coating our products with resin or other coating materials [g] use of our products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of flux is recommended); or washing our products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] use of the products in places subject to dew condensation 4. the products are not subject to radiation-proof design. 5. please verify and confirm characteristics of the final or mou nted products in using the products. 6. in particular, if a transient load (a large amount of load a pplied in a short period of time, such as pulse. is applied, confirmation of performance characteristics after on-board mou nting is strongly recommended. avoid applying power exceeding normal rated power; exceeding the power rating u nder steady-state loading condition may negatively affec t product performance and reliability. 7. de -rate power dissipation (pd) depending on ambient temperature (ta). wh en used in sealed area, confirm the actual ambient temperature. 8. confirm that operation temperature is within the specified range described in the product specification. 9. rohm shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in this document. precaution for mounting / circuit board design 1. when a highly active halogenous (chlorine, bromine, e tc.) flux is used, the residue of flux may negatively affect p roduct performance and reliability. 2. in principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method mu st be used on a through hole mount products. i f the flow soldering method is preferred on a surface-mount p roducts , please consult with the rohm representative in advance. for details, please refer to rohm mounting specification downloaded from: http:///
notice- ge rev.003 ? 2013 rohm co., ltd. all rights reserved. precautions regarding application examples and external circuits 1. if change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the characteristics of the products and external components, inc luding transient characteristics, as well as static characteristics. 2. you agree that application notes, reference designs, and associated data and information contained in this docu ment are presented only as guidance for products use. therefore, i n case you use such information, you are solel y responsible for it and you must exercise your own independ ent verification and judgment in the use of such information contained in this document. rohm shall not be in any way respon sible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such informat ion. precaution for electrostatic this product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. please take pr oper caution in your manufacturing process and storage so t hat voltage exceeding the products maximum rating will not be applied to products. please take special care under dry co ndition (e.g. grounding of human body / equipment / solder iro n, isolation from charged objects, setting of ionizer, friction prevention and temperature / humidity control). precaution for storage / transportation 1. product performance and soldered connections may deteriorate if the products are stored in the places where: [a] the products are exposed to sea winds or corrosive gases, in cluding cl2, h2s, nh3, so2, and no2 [b] the temperature or humidity exceeds those recommended by rohm [c] the products are exposed to direct sunshine or condensation [d] the products are exposed to high electrostatic 2. even under rohm recommended storage condition, solderab ility of products out of recommended storage time period may be degraded. it is strongly recommended to confirm so lderability before using products of which storage time is exceeding the recommended storage time period. 3. store / transport cartons in the correct direction, which is in dicated on a carton with a symbol. otherwise bent leads may occur due to excessive stress applied when dropping of a c arton. 4. use products within the specified time after opening a hum idity barrier bag. baking is required before using products of which storage time is exceeding the recommended storage tim e period. precaution for product label qr code printed on rohm products label is for rohm s internal use only. precaution for disposition when disposing products please dispose them properly usi ng an authorized industry waste company. precaution for foreign exchange and foreign trade act since our products might fall under controlled goods prescr ibed by the applicable foreign exchange and foreign trade act, please consult with rohm representative in case of export. precaution regarding intellectual property rights 1. all information and data including but not limited to ap plication example contained in this document is for referen ce only. rohm does not warrant that foregoing information or da ta will not infringe any intellectual property rights or any other rights of a ny third party regarding such information or data. rohm shall not be in any way responsible or liable for infringement of any intellectual property rights or other d amages arising from use of such information or data.: 2. no license, expressly or implied, is granted hereby under any i ntellectual property rights or other rights of rohm or any third parties with respect to the information contained in this d ocument. other precaution 1. this document may not be reprinted or reproduced, in whole or in part, without prior written consent of rohm. 2. the products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of rohm. 3. in no event shall you use in any way whatsoever the products and the related technical information contained in the products or this document for any military purposes, includi ng but not limited to, the development of mass-destruction weapons. 4. the proper names of companies or products described i n this document are trademarks or registered trademarks of rohm, its affiliated companies or third parties. downloaded from: http:///
datasheet datasheet notice ? we rev.001 ? 2014 rohm co., ltd. all rights reserved. general precaution 1. before you use our pro ducts, you are requested to care fully read this document and fully understand its contents. rohm shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny rohms products against warning, caution or note contained in this document. 2. all information contained in this docume nt is current as of the issuing date and subj ec t to change without any prior notice. before purchasing or using rohms products, please confirm the la test information with a rohm sale s representative. 3. the information contained in this doc ument is provi ded on an as is basis and rohm does not warrant that all information contained in this document is accurate an d/or error-free. rohm shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information. downloaded from: http:///

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